A Power Semiconductor Distributor

Hi Reliability Screening Program

TEST DESCRIPTION

QUALITY ASSURANCE LEVELS

MIL

STX

STXV

INTERNAL VISUAL (PRE-CAP) INSPECTION

TEMPERATURE CYCLING (Method 1051 Condition G 10 cycles)

CONSTANT ACCELERATION 1/ (Method 2006 10k G's Y1 Axis only)

PRE-BURN IN ELECTRICAL TEST

HIGH TEMPERATURE REVERSE BIAS (Burn-in)

Transistors = Method 1039 Cond. A

FETS = Method 1042 Cond. B

Diodes = Method 1038 Cond. A

SCR's = Method 1040

FINAL ELECTRICAL PARAMETER (DC-100%)

HERMETIC SEAL (FINE & GROSS LEAK) /2 (Method 1071)

GROUP A (Static Parameters @25⁰C)

GROUP B SOLDERABILITY /3 (Method 2026)

GROUP B RESISTANCE TO SOLVENTS (Method 1022)

1/ Wire Bond Devices

2/ For Cavity Devices

3/ Without Aging

Please call for any additional testing requirements not listed.